Wire Harness Processing Equipment

Auto 3-Axis AB Glue Dispensing System WPM-5331

The Precision Automatic AB Glue Dispensing Machine is a state-of-the-art 3-axis dispenser control system designed to replace manual operations with highly accurate programming capabilities. With the ability to create dots, strips, arcs, and intricate patterns on various planes or curved surfaces, this machine excels in precision and efficiency. It is compatible with a wide range of adhesive types including anaerobic glues, epoxies, silicones, and more. The system allows for seamless integration with graphics imported from your computer using PLT, TCF, and G code files, making it versatile for different job setups. Perfect for an array of applications such as electronics assembly, vehicle control units, and household appliances, this dispenser ensures high running precision and elevates your production process to new heights.

Automate Precision Bonding with the Advanced AB Glue Dispensing System

Elevate your production efficiency and achieve unparalleled bonding precision with our Automatic AB Glue Dispensing Machine – a cutting-edge 3-axis Dispenser Control System Machine designed to revolutionize your adhesive application processes. This sophisticated AB Glue Dispensing System is engineered to replace time-consuming manual operations, delivering consistent, high-quality results across a vast range of applications.

This automated system is capable of replacing manual operation through high-precision programming , seamlessly executing intricate dispensing patterns with exceptional accuracy. Whether your application requires precise dot, strip, arc, and pattern applications, this machine performs flawlessly on different planes or curved surfaces, offering unmatched versatility in complex assembly processes.

The system is designed to be appropriate for the positioning of various workpieces, accommodating diverse shapes and sizes with ease. Its adaptable design allows for streamlined integration into existing production lines, regardless of workpiece geometry or material.

Furthermore, it supports the import of graphics from computers, including PLT files, TCF files, and G-code files, offering flexible programming options and enabling the creation of intricate and customized dispensing patterns directly from CAD designs or other graphic formats. This advanced feature ensures precise replication of complex designs and streamlines the programming process.

Versatility extends to material compatibility. The AB Glue Dispensing System is compatible with a wide range of glues, encompassing a vast selection of adhesive types to meet diverse application needs. From high-strength Anaerobic adhesives and protective Coatings to fast-curing Cyanoacrylates and general-purpose White Glues, this machine handles them all. Its compatibility extends to robust Epoxy Resins, lubricating Greases, sealing Sealants, flexible Silicones, conductive Solder/Braze Pastes, thermally conductive Thermal Greases, specialized Conductive Adhesives, secure Red Gums, UV-curable UV Glues, the system’s namesake AB Glues, and durable Polyurethane Resin Adhesives, etc. This extensive compatibility ensures the machine can be adapted to a wide array of bonding and sealing requirements across various industries.

This equipment is well-suited for scenarios demanding high efficiency, high running precision, and in the production process of glue dispensing. Ideal for applications requiring consistent, repeatable, and highly accurate adhesive application, this machine excels in demanding production environments. It is generally applicable to products like sensors, relays, power adapters, electronic toys, sounders, electronic components, household appliances, electric vehicle controllers, computer digital products, handicrafts, mobile phone boards, coil products, battery boxes, demonstrating its broad applicability across numerous sectors. Specifically, it excels when used for dot-glue bonding of speakers; speaker packaging and dispensing, optical semiconductors, mobile phone batteries, laptop battery packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, optical device processing, hardware parts package coating, quantitative liquid filling, chip bonding, automotive mechanical parts coating, mechanical seals, etc. – showcasing its diverse capabilities across various complex and precision applications.

Invest in the Automatic AB Glue Dispensing Machine and transform your adhesive application processes. Experience enhanced precision, efficiency, and versatility, achieving consistently superior bonding results and optimizing your production workflow.

WPM-5331
Working size X 500
Y1 300
Y2 300
Z 100
Max Load Y/Y/Z 10kg/5kg
Speed X/Y/Z 800/350 (mm/sec)
Repetitive positioning Accuracy ±0.02mm
Storage capacity Total 100 group, each group 4000points
Programming method Teach pendant
body material sheet metal
Mode of transmission Synchronous belt

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